Electrostatic Chuck Description:
Electrostatic Chuck (ESC) is a crucial component used in semiconductor manufacturing equipment, particularly in plasma etching, chemical vapor deposition (CVD), and physical vapor deposition (PVD) processes. It serves to hold and release semiconductor wafers or substrates securely during processing. The ESC operates based on electrostatic force; when a voltage is applied, it generates an electrostatic field that clamps the wafer in place without physical contact, providing uniform wafer cooling and heating, as well as excellent flatness and minimal backside contamination.
Electrostatic Chuck (ESC) made with Al2O3, or aluminum oxide, is a device used in semiconductor manufacturing equipment to hold and release semiconductor wafers securely during processing. Aluminum oxide is favored for its excellent electrical insulation properties, thermal conductivity, and chemical stability. In the context of an ESC, Al2O3 serves primarily as a dielectric material that facilitates the electrostatic clamping of semiconductor wafers.
Electrostatic Chuck Specifications:
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Chemical Composition
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Al2O3
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Al2O3 Content %
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99
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Density (g/cm3)
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3.91
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Porosity %
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0.16
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Grain Size (μm)
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5.0
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Pore Size (μm)
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Fine
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Volume Resistivity
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>1.0E15@RT
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Vickers hardness
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1900HV
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Flexural Strength
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350MPa
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Cte
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7.24x10-6/℃
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Thermal Conductivity
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32.08 W/(m·K) @25℃
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CP
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0.787 J/g·k
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Dielectric Constant
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9.5 @ 1
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Electrostatic Chuck Applications
1. Semiconductor Manufacturing: ESCs are extensively used in semiconductor fabrication processes, such as photolithography, etching, and chemical vapor deposition (CVD). They hold silicon wafers securely during these processes, ensuring precise alignment and stability. ESCs are also used to hold wafers during the Chemical Mechanical Planarization (CMP) process, which is essential for planarizing the wafer surface.
2. Flat Panel Display (FPD) Manufacturing: ESCs are used to handle and process large, thin, and fragile glass substrates in the production of LCDs, OLEDs, and other flat-panel displays.
3. Microelectromechanical Systems (MEMS): In MEMS manufacturing, ESCs hold micro-scale components securely during various fabrication and assembly processes.
4. Solar Panel Manufacturing: ESCs are employed to handle and process thin-film solar cells and silicon wafers in the production of solar panels.
5. Precision Optics: ESCs are used to hold optical components, such as lenses and mirrors, during precision machining, coating, and assembly processes.
6. Printed Circuit Board (PCB) Manufacturing: ESCs are used to secure PCB substrates during drilling, etching, and other fabrication processes, ensuring precise alignment and stability.
7. Vacuum Coating: ESCs are used in vacuum chambers to hold substrates during thin-film deposition processes, such as sputtering and evaporation.
8. Surface Analysis and Metrology: ESCs are used to hold samples securely during surface analysis techniques, such as scanning electron microscopy (SEM) and atomic force microscopy (AFM), providing stable and precise positioning.
9. Lithography: In photolithography, ESCs hold photomasks and wafers in precise alignment for accurate pattern transfer.
10. Additive Manufacturing: ESCs can be used to hold thin layers of materials in place during various 3D printing processes, especially in high-precision additive manufacturing applications.
11. High-Temperature Processing: ESCs are used in applications requiring high-temperature processing, where traditional mechanical clamping might not be feasible or could damage the workpiece.
Electrostatic Chuck Packaging
Our Electrostatic Chuck is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
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