AC2469 Alumina Ceramic Foam Brick

Catalog No. AC2469
Material Al2O3
Purity >99.6%
Heat Conductivity Coefficient 0.85-1.2 W/(m.k)

Alumina ceramic foam brick supplied in Stanford Advanced Materials is available in a variety of shapes. We have two decades’ experience in supplying high purity alumina ceramic foam bricks to fulfill most of the requirements.

Related products: Light Mullite Brick, Acid Resist Brick, High Purity Alumina Ceramic Foam Insulation.

Alumina Ceramic Foam Brick Description

Alumina ceramic foam brick has excellent resistance to corrosion and corrosion of molten aluminum, so it can effectively remove inclusions. Due to its lightweight and low thermal conductivity, the foamed alumina has less accumulated heat energy and obvious energy-saving effect. The precise appearance dimensions of alumina filter bricks can speed up the masonry speed and ensure high strength and stability of the masonry.

 

Alumina Ceramic Foam Brick Advantages

- Higher-strength than refractory ceramic fiber and a lightweight ceramic brick.
- Low density
- Low thermal conductivity and linear thermal expansion coefficient.
- Great thermal shock resistance.
- Safe and rapid maintenance.

 

Alumina Ceramic Foam Brick Specification

Item

SAMCFI-C1

SAMCFI-C2

SAMCFI-C3

SAMCFI-C4

SAMCFI-C5

Bulk Density/g·cm﹣³<

0.8

1

1.2

1.4

1.6

Al₂O₃ Content/%>

99.6

99.6

99.6

99.6

99.6

Impurity %<

0.1

0.1

0.1

0.1

0.1

Compressive Strength>Mpa

30

65

72

97

135

Returning Line Change Rate(1800°C×12h)%<

0.45

0.4

0.35

0.35

0.3

Heat Conductivity Coefficient W/(m.k)

0.85

0.9

0.9

0.95

1.2

Mean Temperature 1100±25°C

Working Temperature/°C

1800

1800

1800

1800

1800

Max. Temperature/°C

1850

1850

1850

1850

1850

 

Alumina Ceramic Foam Brick Applications

Alumina ceramic foam brick can be used as the heat-insulating layer of the refractory lining on the hot side, especially the high-temperature reducing atmosphere furnace (1850 °C). It can be used for a long time under 1800 °C air and reducing atmosphere. 

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