|Material||Pure aluminum (Al)|
The bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. SAM can provide Al bonding wire with different wire diameters from 18um-80um according to customer requirements.
- Smartphone and phone
- Wearable electronics
- CV therapy
- Orthopedics and spine
- Commercial aircraft
- NFC technology
- Power generation
CY2173 Sapphire Wafer
AL2334 Aluminum Wire Mesh
AL2445 AZO Coated Glass
AL2549 Potassium Hexafluoroaluminate Powder (CAS 13775-52-5)
AL2665 Aluminum Metaphosphate Powder (CAS 13776-88-0)
AL2746 Aluminum Sulfide Powder & Lump (CAS NO. 1302-81-4)
AL2804 Aluminum Selenide (CAS 1302-82-5)
AL3258 Electrostatic Chuck (Al2O3, AlN, Sapphire)
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