|Material||Pure aluminum (Al)|
The bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. SAM can provide Al bonding wire with different wire diameters from 18um-80um according to customer requirements.
- Smartphone and phone
- Wearable electronics
- CV therapy
- Orthopedics and spine
- Commercial aircraft
- NFC technology
- Power generation
AL2804 Aluminum Selenide (CAS 1302-82-5)
AL3258 Electrostatic Chuck (Al2O3, AlN, Sapphire)
AL3442 Aluminum Alloy 5083 Sheet
AL3535 Aluminum Titanium Boron Rod (AlTiB)
AL3536 Aluminum Titanium Boron Ingot (AlTiB)
AL3537 Aluminum Titanium Boron Alloy Wire (AlTiB)
AL3538 Aluminum-Silicon Master Alloy Ingot (AlSi20)
AL3539 Aluminum Titanium Carbon Alloy Rod (AlTiC)
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