HTCC Aluminum Nitride Heater Description
HTCC Aluminum Nitride Heater leverages the high thermal conductivity and electrical insulation properties of AlN with the robust, multilayer capabilities of HTCC technology. These heaters are ideal for high-temperature, high-precision applications in semiconductor manufacturing, medical and laboratory equipment, aerospace, industrial heating, and optoelectronics. Their durability, efficiency, and customization options make them valuable components in advanced technological and industrial processes.
HTCC stands for High-Temperature Co-Fired Ceramic. It is a technology used in the fabrication of multilayer ceramic substrates and electronic circuits. HTCC involves the co-firing of ceramic and metal layers at high temperatures, resulting in a highly durable and stable product suitable for high-temperature and high-performance applications.
HTCC Aluminum Nitride Heater Specification
Heating Material
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AlN
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Thickness
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0.8-3.0 mm
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Size
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Customized
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Max. Working Temp.
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1000℃
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Density
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3.3 g/cm3
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Heating speed
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≤120 ℃/s
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Maximum Watt Density
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155 W/cm2
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Thermal Conductivity
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220 W/mK
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HTCC Aluminum Nitride Heater Application
1. Semiconductor Manufacturing:
- Wafer Processing: Used in semiconductor wafer processing equipment for applications such as epitaxy, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
- Test Equipment: Employed in test and measurement equipment for semiconductor devices.
2. Medical and Laboratory Equipment:
- DNA Amplification: Used in PCR (Polymerase Chain Reaction) devices for DNA amplification, where precise temperature control is critical.
- Analytical Instruments: Integrated into analytical instruments that require high-temperature operation, such as mass spectrometers and chromatography equipment.
3. Aerospace and Defense:
- Thermal Management: Used in thermal management systems for avionics and other high-performance electronic systems.
4. Industrial Heating:
- Plastic Welding: Used in plastic welding equipment where high temperatures are needed for precise welding operations.
- Heating Plates and Hot Plates: Employed in heating plates and hot plates for various industrial processes.
5. Optoelectronics:
- LED Manufacturing: Used in the manufacturing of LEDs where high temperatures and precise thermal control are required.
- Laser Diodes: Integrated into laser diode assemblies for efficient thermal management.
HTCC Aluminum Nitride Heater Packaging
Our HTCC Aluminum Nitride Heater is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
HTCC Aluminum Nitride Heater FAQs
Q1: What does HTCC technology entail?
HTCC technology involves creating multilayer ceramic substrates and circuits by co-firing ceramic and metal layers at high temperatures. This process results in a highly durable and stable structure suitable for high-performance applications.
Q2: How are HTCC Aluminum Nitride Heaters manufactured?
HTCC Aluminum Nitride heaters are manufactured by layering ceramic and metal pastes, which are then co-fired at high temperatures to create an integrated structure.
Q3: Why are HTCC Aluminum Nitride Heaters used in semiconductor manufacturing?
HTCC Aluminum Nitride heaters provide precise and uniform heating, essential for semiconductor manufacturing processes. Their high thermal conductivity and electrical insulation ensure efficient and reliable performance.