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BC0970 Beryllium Oxide Ceramic Substrates, BeO Maximize

BC0970 Beryllium Oxide Ceramic Substrates, BeO

Catalog No.BC0970
MaterialBeryllium Oxide
CAS Number1304-56-9
Bulk Density(g/cm3)3.01

SAM's beryllium oxide ceramic substrates are made of high purity beryllium oxide ceramics. SAM provides high-quality beryllium oxide ceramic products including heat sinks, crucibles, washers, thermocouple tubings, and other custom-made substrates.

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Beryllium Oxide Ceramic Substrates Description

Beryllium oxide ceramic substrates are made of high purity beryllium oxide ceramics. Beryllium oxide, or beryllia, is the best ceramic thermal conductor and competes with the most conductive metals, and its electrical isolation is equivalent to that of alumina and the best electrical insulators. Beryllium oxide ceramic substrates are produced by ceramic fabrication techniques, followed by sintering at temperatures above 1500 °C. By applying precision fabricating techniques, close dimensional tolerances and high surface smoothness can be obtained for maximum compatibility with metal components. BeO substrates possess a unique combination of thermal, dielectric, and mechanical properties, and they are highly desirable in electronic applications. 

BC0970 Beryllium Oxide Ceramic Substrates, BeO 


Beryllium Oxide Ceramic Substrates Specifications

Testing EntriesTesting ConditionsProperties
Flexural Strength/170MPa
Thermal Conductivity25250W/m·k
Permittivity1MHz 206.5-7.5
10GHz 206.5-7.5
Volume Resistivity2510^14Ω·cm


Beryllium Oxide Ceramic Substrates Applications

Beryllium oxide ceramic substrate is the ideal material used in many high-performance semiconductor parts for applications such as radio equipment. Beryllium oxide ceramic can insulate electronic devices electrically, and at the same time remove substantial quantities of heat from them to a chassis heat sink.  Beryllium oxide ceramic is used as a filler in some thermal interface materials such as thermal grease. Some power semiconductor devices have used beryllium oxide ceramic between the silicon chip and the metal mounting base of the package in order to achieve a lower value of thermal resistance than for a similar construction made with alumina. It is also used as a structural ceramic for high-performance microwave devices, vacuum tubes, magnetrons, and gas lasers. 

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