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  • CB4348 Electroplated Diamond Saw Blade

    • CB4348 Electroplated Diamond Saw Blade

    Catalog No. CB4348
    Material Diamond + Resin
    Inner hole (mm) 20
    Diameter 100-230 mm
    Thickness 1.2-1.8 mm

    Electroplated Diamond Saw Blade is great for use on angle grinders or stone saws to achieve effective cutting performance. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Electroplated Diamond Saw Blade.

    Related products: Resin Bond Diamond Grinding Wheel, Resin Bond CBN Grinding Wheel for Steel, Resin Bond Diamond Grinding Wheel (Cup Shape)

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    Electroplated Diamond Saw Blade
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