AL3258 Electrostatic Chuck (Al2O3, AlN, Sapphire)

Catalog No. AL3258
Material Al2O3, AlN, Sapphire
Size Designed for φ200/300mm Equipment
Purity ≥99.9%

Electrostatic Chuck features high purity, high plasma durability, good chucking/de-chucking response, and high-temperature and low-temperature application. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality alumina products.

Related products: Aluminum Oxide Sapphire Crystal Substrate, Sapphire windows, Sapphire Wafer, Aluminum Nitride Custom Machined Parts

Electrostatic Chuck Description

A built-in electrode is embedded, using the electrostatic force generated between the structure and the silicon wafer placed on the surface of the ESC. In the semiconductor manufacturing process, this type of product can be used for silicon wafer installation, flatness correction, and silicon wafer cooling.

Electrostatic Chuck Specifications

- Designed for φ200/300mm Equipment

- High-purity Al2O3/AlN/Sapphire material

- High plasma durability

- Good chucking/de-chucking response

- Withstand the extreme natural condition of some samples in both high and low temperature

                                               Material
Item

Sapphire

Color

Transparent

Content (%)

99.99

Density (g/cm3)

3.97

Vickers Hardness HV9.807N (Gpa)

22.5

Young's Modulus (Gpa)

470

Compressive Strength (Mpa)

2,940

Thermal Conductivity (20℃) (W/(m·K)

41

Electrostatic Chuck Applications

Electrostatic Chuck is used for silicon wafer installation, flatness correction, and silicon wafer cooling.

Electrostatic Chuck Packaging

Our Electrostatic Chuck is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

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