High-Flow LCP Description:
High-flow Liquid Crystal Polymer (LCP) exhibits excellent flow characteristics, making it ideal for intricate and thin-walled component molding. It maintains high dimensional stability, low warpage, and minimal shrinkage even under extreme temperature conditions. Additionally, High-flow LCP offers outstanding mechanical strength, chemical resistance, and electrical insulation properties, making it suitable for advanced electronic, automotive, and industrial applications.
High-Flow LCP Specifications:
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Material
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LCP
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Density
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1.68 g/cm3
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Tensile Strength
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120 MPa
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Tensile Modulus
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16000 MPa
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Elongation at Break
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1.8%
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Flexural Strength
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170 MPa
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Flexural Modulus
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13000 MPa
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Notched Impact Strength
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75 J/m
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HDT
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260°C
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Dielectric Constant
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3.8
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Dielectric Dissipation Factor
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0.0036
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Volume Resistivity
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10^13~16 Ω•cm
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Dielectric Strength
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≥48.2 KV
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High-Flow LCP Applications:
1.Memory Slots: The high-flow properties and thermal stability of LCP make it suitable for manufacturing memory slots, where precise dimensions and heat resistance are crucial for performance.
2. I/O Connectors: Its excellent flow characteristics allow for the molding of intricate shapes, making LCP ideal for input/output connectors that require high electrical insulation and mechanical strength.
3. Sockets: High-flow LCP's ability to maintain dimensional stability under high temperatures makes it well-suited for use in sockets, providing reliable performance in electronic assemblies.
4. Card Edge Connectors: LCP's combination of high flow, low warpage, and high mechanical strength supports the manufacturing of card edge connectors, ensuring consistent and robust connections in various electronic devices.
High-Flow LCP Packing:
Our High-Flow LCP is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
25kg/net paper bag lined with aluminum foil
High-Flow LCP FAQ:
Q1: What are the key benefits of using High-Flow LCP?
A1: High-Flow LCP offers excellent flow characteristics for molding complex shapes, high thermal stability, low warpage, and good mechanical strength. These properties make it ideal for high-precision applications like connectors and sockets.
Q2: What types of applications is High-Flow LCP best suited for?
A2: High-Flow LCP is commonly used in memory slots, input/output connectors, sockets, and card edge connectors due to its dimensional stability and ability to form intricate shapes.
Q3: How does High-Flow LCP compare to standard LCP materials?
A3: Compared to standard LCP, High-Flow LCP exhibits better flow during molding, making it suitable for thinner walls and more complex geometries while still providing excellent thermal and mechanical properties.
