Indium Tin Alloy Foil Description
Indium Tin Alloy Foil is a solid metallic foil composed of a combination of indium and tin. This alloy is notable for its unique properties and applications, especially in the electronics and semiconductor industries. The alloy exhibits good resistance to oxidation and corrosion, which enhances its durability in various environments.
Indium Tin Alloy Foil Specifications
Material
|
In/Sn
|
Density (g/cm3)
|
7.3
|
Shape
|
Foil
|
Size (mm)
|
Thickness: 1-4
Wideness*Length: customized
|
Physical Properties
Melting Point (℃)
|
Solid phase/liquid phase
|
118
|
Thermal conductivity
|
(W/m·K)
|
34
|
Density
|
(g/cm3)
|
7.3
|
Resistivity
|
μΩ·m
|
0.147
|
Coefficient of thermal expansion
|
10-6/℃
|
20
|
Tensile strength
|
Mpa
|
12
|
Indium Tin Alloy Foil Applications
- Soldering in Electronics: Ideal for soldering delicate components that could be damaged by higher temperatures.
- Semiconductor Manufacturing: Used in bonding applications for semiconductor chips and devices.
- Thermal Management: Applied in thermal interface materials to enhance heat dissipation in electronic assemblies.
- Optoelectronics: Used in the manufacture of optoelectronic devices such as LEDs and photodetectors.
Indium Tin Alloy Foil Packaging
Our Indium Tin Alloy Foil is carefully handled during storage and transportation to preserve the quality of our Product in its original condition.