WM1244 Ion Implantation Components (Tungsten) (Discontinued)

Catalog No. WM1244
Material Tungsten and Tungsten Alloy
Purity ≥98%
CAS Number 7440-33-7
Shape Customized
Temperature Range(F) 1000-3000°С
MSDS/SDS Download MSDS/SDS

 (Discontinued)

Ion implantation is an important process that is widely used in semiconductor device fabrication. Stanford Advanced Materials (SAM) provides customized ion implantation components with high quality and competitive prices.
Related products: ion implantation components (Molybdenum), ion implantation components (TZM)

Ion Implantation Components (Tungsten) Description:

Ion implantation is an important process that is widely used in semiconductor device fabrication, metal finishing, and materials science research. The components of ion implantation are often made of TZM, molybdenum, tungsten because these materials could perform well in harsh environments.

ion implantation component (tungsten) ion implantation component (tungsten)

ion implantation component (tungsten) ion implantation component (tungsten)

Ion Implantation Components (Tungsten) Applications:

• Used to manufacture semiconductors.
• Used in metal finishing for tool steel toughening and surface finishing.
• Used in ion beam mixing to achieve graded interface and strengthen adhesion between immiscible material.

Ion Implantation Components (Tungsten) Specifications:

Customized

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TZM1245 Ion Implantation Components (TZM Alloy) (Discontinued)

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