Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip Description:
Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip is made from high-purity alumina, offering excellent thermal conductivity and superior electrical insulation. The nickel-palladium-gold plating provides enhanced corrosion resistance, improved solderability, and strong wire bonding capability. This chip is designed for efficient heat dissipation and stable electrical performance, making it ideal for high-power semiconductor devices, RF applications, laser diodes, and aerospace components. Its double-sided plating ensures reliable performance in demanding environments.
Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip Specifications:
Material
|
Nickel, Gold, Palladium, Alumina
|
Color/Appearance
|
Golden Yellow Plate
|
Thicknesses
|
0.25mm
|
Layers
|
Double-sided
|
Size
|
2.2×3mm (single size)
|
Plate Copper Thickness
|
18um
|
Finish
|
Immersion Nickel Palladium Gold
|
line width and spacing
|
0.2/0.1mm
|
Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip Applications:
The Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip is used in high-power semiconductor devices, laser diodes, RF components, and power electronics, where efficient heat dissipation, electrical insulation, and corrosion resistance are essential. It's also applied in aerospace and telecommunications for reliable thermal management in demanding environments.
Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip Packing:
Our Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip FAQ:
Q1: What is a Double-Sided Nickel-Palladium-Gold Plated Alumina Semiconductor Cooling Chip?
A1: It is a high-performance semiconductor cooling solution made from alumina, with a nickel-palladium-gold plating on both sides to improve heat dissipation, electrical insulation, and corrosion resistance, making it ideal for high-power semiconductor applications.
Q2: What are the key benefits of using this cooling chip?
A2: The chip provides excellent thermal conductivity, superior electrical insulation, high mechanical strength, and enhanced corrosion resistance, ensuring efficient heat management and reliable performance in demanding environments.
Q3: What are the typical applications for this cooling chip?
A3: It is used in high-power semiconductor devices, laser diodes, RF components, power electronics, and aerospace applications, where effective thermal management and stable electrical performance are crucial.