3-Layer Damming Nickel-Palladium-Gold Plated Alumina Ceramic Substrate Description:
The 3-Layer Damming Nickel-Palladium-Gold Plated Alumina Ceramic Substrate is designed for high-performance electronic applications, featuring a 3-layer structure for improved thermal dissipation and electrical insulation. The nickel-palladium-gold plating enhances solderability, oxidation resistance, and corrosion resistance, making it ideal for use in demanding environments. The damming structure provides added protection for sensitive components, ensuring high reliability in power electronics, semiconductor devices, and RF circuits. This substrate offers excellent thermal conductivity and long-term stability, ensuring optimal performance in high-power and high-frequency applications.
3-Layer Damming Nickel-Palladium-Gold Plated Alumina Ceramic Substrate Specifications:
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Material
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Nickel, Gold, Palladium, Alumina
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Color/Appearance
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Golden Plate
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Thicknesses
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0.5mm
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Layers
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Double-sided
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Substrate type
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Alumina
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Plate Copper Thickness
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100um
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Solder Resist
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Black Oil
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Surface treatment
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Immersion Nickel-Palladium-Gold
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Processing
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Waterjet Cutting
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Special process
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Three-layer dam.
Dam shape and height can be designed according to requirements
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3-Layer Damming Nickel-Palladium-Gold Plated Alumina Ceramic Substrate Applications:
The 3-Layer Damming Nickel-Palladium-Gold Plated Alumina Ceramic Substrate is used in high-power electronic applications, including power electronics, semiconductor devices, and RF circuits. Its superior thermal conductivity, electrical insulation, and corrosion resistance make it ideal for demanding environments like automotive electronics, telecommunications, and aerospace systems.
3-Layer Damming Nickel-Palladium-Gold Plated Alumina Ceramic Substrate Packing:
Our 3-Layer Damming Nickel-Palladium-Gold Plated Alumina Ceramic Substrate is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
3-Layer Damming Nickel-Palladium-Gold Plated Alumina Ceramic Substrate FAQ:
Q1: What is a 3-Layer Damming Nickel-Palladium-Gold Plated Alumina Ceramic Substrate?
A1: It is a high-performance ceramic substrate with a 3-layer damming structure, nickel-palladium-gold plating, and alumina material. This design enhances thermal conductivity, electrical insulation, and corrosion resistance for use in demanding electronic applications.
Q2: What are the advantages of using this substrate?
A2: The 3-layer damming structure improves thermal dissipation and protects sensitive components, while the nickel-palladium-gold plating provides better solderability, oxidation resistance, and corrosion protection, making it ideal for high-power and high-frequency applications.
Q3: What are the typical applications for this substrate?
A3: This substrate is used in power electronics, semiconductor devices, RF circuits, and applications that require high thermal management and electrical insulation. It is commonly found in automotive electronics, telecommunications, and aerospace systems.
