Aluminum Nitride Ceramic Substrate with Nickel-Palladium Plating and Dam Structure Description:
The Aluminum Nitride Ceramic Substrate with Nickel-Palladium Plating and Dam Structure is a high-performance material designed for demanding electronic applications. It combines superior thermal conductivity from the aluminum nitride (AlN) base with nickel-palladium-gold plating, enhancing solderability, corrosion resistance, and oxidation protection. The damming structure offers additional protection for sensitive components, making it ideal for use in power electronics, semiconductor devices, and RF circuits. This material provides excellent electrical insulation, high reliability, and long-term stability, making it perfect for high-power and high-frequency applications.
Aluminum Nitride Ceramic Substrate with Nickel-Palladium Plating and Dam Structure Specifications:
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Material
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Nickel, Gold, Palladium, AlN
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Color/Appearance
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Golden Plate
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Thicknesses
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0.5mm
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Layers
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Double-sided
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Substrate type
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Aluminum Nitride
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Copper thickness
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950um at dam height, 200um at bottom surface
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Through-hole
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0.1 plating hole filling
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Surface treatment
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Immersion nickel palladium
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Exterior processing
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Laser cutting
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Special process
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The three-dimensional structure of the dam, the shape, and the height of the dam can be customized.
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Aluminum Nitride Ceramic Substrate with Nickel-Palladium Plating and Dam Structure Applications:
The Aluminum Nitride Ceramic Substrate with Nickel-Palladium Plating and Dam Structure is used in high-performance applications such as power electronics, semiconductor devices, RF circuits, and heat management solutions. Its excellent thermal conductivity, electrical insulation, and corrosion resistance make it ideal for high-power systems, automotive electronics, telecommunications, and aerospace applications.
Aluminum Nitride Ceramic Substrate with Nickel-Palladium Plating and Dam Structure Packing:
Our Aluminum Nitride Ceramic Substrate with Nickel-Palladium Plating and Dam Structure is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
Aluminum Nitride Ceramic Substrate with Nickel-Palladium Plating and Dam Structure FAQ:
Q1: What is Aluminum Nitride Ceramic Substrate with Nickel-Palladium Plating and Dam Structure?
A1: It is a high-performance ceramic material made from aluminum nitride with a damming structure, coated with nickel-palladium-gold plating to enhance thermal conductivity, electrical insulation, and corrosion resistance.
Q2: What are the key advantages of using this material?
A2: The aluminum nitride base offers superior thermal conductivity, while the nickel-palladium-gold plating improves solderability and resistance to oxidation and corrosion. The damming structure adds protection for sensitive components.
Q3: What are the typical applications for this ceramic material?
A3: It is used in power electronics, semiconductor devices, RF circuits, and high-frequency applications where efficient thermal management and electrical insulation are critical.
