MC6508 Nickel-Gold Plated Aluminum Nitride Substrate

Nickel-Gold Plated Aluminum Nitride Substrate Description:

Nickel-Gold Plated Aluminum Nitride Substrate combines the high thermal conductivity of aluminum nitride with nickel-gold plating for enhanced solderability and corrosion resistance. The 0.07mm copper layer improves electrical conductivity and supports high-power applications. This material offers superior thermal management, electrical insulation, and reliability, making it ideal for use in power electronics, semiconductor devices, and high-frequency circuits. Its combination of low thermal expansion, high durability, and long-term stability ensures optimal performance in demanding environments.

Nickel-Gold Plated Aluminum Nitride Substrate Specifications:

Nickel-Gold Plated Aluminum Nitride Substrate Applications:

The Nickel-Gold Plated Aluminum Nitride Substrate is used in power electronics, semiconductor devices, high-frequency circuits, and other applications requiring efficient thermal management, electrical insulation, and durability. It is ideal for use in LED drivers, power modules, and high-performance electronic systems.

Nickel-Gold Plated Aluminum Nitride Substrate Packing:

Our Nickel-Gold Plated Aluminum Nitride Substrate is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

Nickel-Gold Plated Aluminum Nitride Substrate FAQ:

Q1: What is a Nickel-Gold Plated Aluminum Nitride Substrate?

A1: It is a high-performance substrate made from aluminum nitride with nickel-gold plating, featuring a 0.07mm copper layer to enhance thermal conductivity and electrical performance.

Q2: What are the benefits of the nickel-gold plating on this substrate?

A2: The nickel-gold plating improves solderability, provides excellent corrosion resistance, and ensures long-term reliability in demanding environments.

Q3: What is the thermal conductivity of this substrate?

A3: The aluminum nitride base offers excellent thermal conductivity, making it suitable for applications requiring efficient heat dissipation.