Double-Sided Nickel-Palladium-Gold Plated Aluminum Nitride (AlN) Substrate Description:
The Double-Sided Nickel-Palladium-Gold Plated Aluminum Nitride (AlN) Substrate features high thermal conductivity, excellent electrical insulation, and superior mechanical strength. The nickel-palladium-gold plating enhances solderability, corrosion resistance, and reliability, making it suitable for high-power and high-frequency applications. With its low dielectric loss and high-temperature stability, this substrate is ideal for advanced electronic packaging, RF devices, and power modules, ensuring efficient heat dissipation and long-term performance in demanding environments.
Double-Sided Nickel-Palladium-Gold Plated Aluminum Nitride (AlN) Substrate Specifications:
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Material
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Nickel, Palladium, Gold, AlN
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Color/Appearance
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Silvery and Golden Plate
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Thicknesses
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0.5mm
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Layers
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Double-sided
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Size
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100×100mm
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Copper thickness
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0.070mm
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Copper thickness in the hole
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0.070mm
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Minimum hole distance
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0.09mm
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Surface treatment
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Immersion nickel palladium gold
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Line width and spacing
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0.2/0.12mm
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Double-Sided Nickel-Palladium-Gold Plated Aluminum Nitride (AlN) Substrate Applications:
The Double-Sided Nickel-Palladium-Gold Plated Aluminum Nitride (AlN) Substrate is used in high-power electronics, RF and microwave devices, LED packaging, laser modules, power modules, and automotive and aerospace electronics. Its high thermal conductivity and excellent electrical insulation make it ideal for applications requiring efficient heat dissipation and reliable performance in demanding environments.
Double-Sided Nickel-Palladium-Gold Plated Aluminum Nitride (AlN) Substrate Packing:
Our Double-Sided Nickel-Palladium-Gold Plated Aluminum Nitride (AlN) Substrate is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
Double-Sided Nickel-Palladium-Gold Plated Aluminum Nitride (AlN) Substrate FAQ:
Q1: What are the main characteristics of this substrate?
A1: This substrate features high thermal conductivity, excellent electrical insulation, outstanding mechanical strength, and a nickel-palladium-gold plating that ensures good solderability and corrosion resistance.
Q2: What applications is this product suitable for?
A2: It is mainly used in high-power electronic devices, RF and microwave equipment, LED packaging, laser modules, power electronics modules, as well as automotive and aerospace electronic systems.
Q3: What is the thermal conductivity of this substrate?
A3: Aluminum nitride (AlN) substrates typically have a thermal conductivity of 170-200 W/m·K, significantly higher than conventional ceramic materials such as alumina (Al₂O₃).
