MC6512 Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate

Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate Description:

The Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate combines the high thermal conductivity of aluminum nitride with the enhanced solderability provided by silver plating. It offers excellent electrical insulation, making it ideal for high-density applications that require efficient heat dissipation and reliable electrical performance. The fine-pitch design allows for compact assembly of electronic components, making it suitable for use in power modules, RF devices, LED packaging, and other advanced electronics where space efficiency and thermal management are critical. The silver plating enhances the substrate's resistance to corrosion and ensures stable, high-quality solder joints.

Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate Specifications:

Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate Applications:

The Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate is used in high-density applications such as power modules, RF devices, LED packaging, automotive electronics, and other advanced electronic systems where efficient thermal management, electrical insulation, and compact designs are essential.

Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate Packing:

Our Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate FAQ:

Q1: What are the key features of the Fine-Pitch Silver-Plated Aluminum Nitride (AlN) Ceramic Substrate?

A1: This substrate offers high thermal conductivity, excellent electrical insulation, and fine-pitch design. The silver plating improves solderability and provides corrosion resistance for reliable electrical connections.

Q2: What is the thermal conductivity of this AlN ceramic substrate?

A2: The Fine-Pitch Silver-Plated AlN Ceramic Substrate has exceptional thermal conductivity, typically around 170-200 W/m·K, allowing for efficient heat dissipation in high-performance applications.

Q3: What applications are suitable for this fine-pitch AlN substrate?

A3: It is ideal for power modules, RF devices, LED packaging, automotive electronics, and other compact, high-performance electronic applications that require efficient thermal management and electrical insulation.