NN0249 Nano Copper Powder (Cu)

Nano Copper Powder Description

Nano Copper Powder exhibits unique properties that arise from its nanoscale size, offering a high surface area to volume ratio which significantly enhances its reactivity and conductivity. It has a melting point of approximately 1085°C and a density of around 8.96 g/cm³. This powder is characterized by excellent electrical and thermal conductivity, making it ideal for applications in electronics, such as conductive inks, coatings, and interconnects. Nano Copper Powder also demonstrates superior catalytic properties, useful in chemical reactions like CO2 reduction and organic transformations. Its antimicrobial properties are leveraged in medical devices and coatings to inhibit bacterial growth. Furthermore, the high surface area and reactivity of nano copper make it suitable for use in energy storage devices, including batteries and supercapacitors, where it improves performance and efficiency.

Nano Copper Powder Specification

Nano Copper Powder Applications

1. Electronics and Conductive Inks: Nano Copper Powder is widely used in the production of conductive inks and pastes for printed electronics, including flexible circuits, RFID tags, and solar cells. Its excellent electrical conductivity makes it a cost-effective alternative to silver.

2. Catalysis: Nano Copper Powder acts as a highly effective catalyst in various chemical reactions, including CO2 reduction, hydrogenation, and organic synthesis. Its high surface area and reactivity enhance catalytic efficiency and selectivity.

3. Energy Storage: In batteries and supercapacitors, nano copper is used to improve the performance and efficiency of electrodes. Its high electrical conductivity and surface area contribute to better charge/discharge rates and energy density.

4. Antimicrobial Coatings: The antimicrobial properties of nano copper make it suitable for coatings in medical devices, textiles, and surfaces in healthcare settings to inhibit bacterial and microbial growth, enhancing hygiene and reducing the risk of infections.

5. Additive Manufacturing: Nano Copper Powder is used in 3D printing and additive manufacturing processes to produce high-precision, conductive components for electronic devices, sensors, and other advanced applications.

6. Thermal Management: Due to its excellent thermal conductivity, nano copper is used in thermal management solutions such as heat sinks, thermal interface materials, and cooling systems for electronics and high-performance computing devices.

7. Lubricants and Wear-Resistant Coatings: Nano Copper Powder can be added to lubricants and coatings to enhance their wear resistance, reducing friction and extending the lifespan of mechanical components.

8. Metallurgy and Alloy Production: In metallurgy, nano copper is used to improve the properties of copper alloys, including strength, hardness, and corrosion resistance. It also enhances the sintering process in powder metallurgy.

9. Sensors: The high sensitivity and conductivity of nano copper are utilized in the fabrication of various types of sensors, including gas sensors, biosensors, and pressure sensors, providing improved performance and accuracy.

Nano Copper Powder Packing

Our Nano Copper Powder is carefully handled during storage and transportation to preserve the quality of our product in its original condition.