Copper Tin Nanopowder Description
Copper Tin Nanopowder refers to a fine powder composed of nanoparticles of an alloy containing both copper (Cu) and tin (Sn). The low melting point and good wetting properties of copper tin nanopowder make it suitable for bonding metals in electronic assemblies and other joining processes. Copper has known antimicrobial properties, and copper tin nanopowder might be explored for potential antimicrobial applications in various industries, including healthcare and materials science.
Copper Tin Nanopowder Specifications
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Chemical Composition
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Sn : Cu = 90 : 10
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Appearance
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Tan powder
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Average Particle Size (nm)
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35-95
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True Density (g/cm3)
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8.94
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Melting Point (℃)
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1083
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Boiling Point (℃)
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2595
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Purity %
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99.9
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Copper Tin Nanopowder Applications
1. Soldering and Electronics: Used as a lead-free solder material in electronics manufacturing, providing excellent electrical conductivity and strong mechanical bonds at lower temperatures compared to traditional solder materials.
2. Battery Technology: Incorporated in anodes for lithium-ion batteries and other rechargeable batteries, enhancing energy capacity, cycling stability, and overall performance.
3. Catalysis: Employed as a catalyst in various chemical reactions, including hydrogenation and dehydrogenation processes, due to its high catalytic activity and selectivity.
4. Metal Alloys: Used in the production of various metal alloys, such as bronze, where it improves mechanical properties, corrosion resistance, and wear resistance.
5. Additive Manufacturing: Utilized in 3D printing and additive manufacturing to produce metal parts with enhanced strength, conductivity, and durability.
6. Tribology: Applied in coatings and lubricants to reduce friction and wear in mechanical systems, extending the life of components and improving efficiency.
7. Sensors: Used in the development of gas sensors and biosensors, where their sensitivity and rapid response times are beneficial for detecting chemical and biological substances.
8. Thermal Management: Employed in thermal management applications, such as heat sinks and thermal interface materials, due to its excellent thermal conductivity.
9. Antimicrobial Applications: Leveraged for its antimicrobial properties in coatings and surface treatments to inhibit the growth of bacteria and other microorganisms.
Copper Tin Nanopowder Packaging
Our Copper Tin Nanopowder is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
