CM3430 Phosphor Bronze Ball

Catalog No. CM3430
Material P, Cu
Appearance Bronze ball
Content (Cu+Ag)≥99.90%

Phosphor Bronze Ball is used in PCB plating. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Phosphor Bronze Ball.

Related products: Copper (Cu) Evaporation Materials, Brass Powder, Tungsten (W) Balls and Spheres

Phosphor Bronze Ball Description

Deoxidized copper (DLP or DHP) is obtained by adding phosphorus to the ETP copper refined by electrolytic copper melting and deoxidation. After adding sufficient phosphorus to the deoxidized copper, the final production of oxygen content reaches below 0.01%, and the residual phosphorus content is 0.040~0.065%, phosphor copper.

Phosphor Bronze Ball Specifications

Specifications

Size (mm)

Weight

φ55

54.0-56.5

800±10

φ50

49.0-52.0

600±6

φ45

43.5-46.0

425±6

φ38

36.5-39.0

256±6

φ30

28.5-31.0

125±5

φ25

23.5-26.0

74±5

φ11

9.5-13.0

7±3

Chemical Composition

Cu+Ag

P

Fe

Pb

Ni

Sn

Sb

As

S

O

99.90

0.040-0.065

0.0025

0.003

0.003

0.003

0.003

0.003

0.003

0.002

Phosphor Bronze Ball Applications

PCB plating.

Phosphor Bronze Ball Packaging

Our Phosphor Bronze Ball is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

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