Potassium Niobate Sputtering Target Description
Potassium Niobate Sputtering Target is composed of potassium, niobium, and oxygen with the chemical formula of KNbO3. High-purity potassium niobate sputter targets play a huge role in deposition processes to ensure high-quality deposited film. Stanford Advanced Materials (SAM) specializes in producing up to 99.9995% purity sputtering targets using quality assurance processes to guarantee product reliability.
Potassium Niobate Sputtering Target Specification
Material Type |
Potassium Niobate |
Symbol |
KNbO3 |
Color/Appearance |
Solid |
Melting Point |
≈ 1100 °C |
Density |
4.640 g/cm3 |
Type of Bond |
Elastomer, Indium |
Available Sizes |
Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ Thick: 0.125″, 0.250″ |
Other sizes are also available. Please contact us for customized sputtering targets.
Potassium Niobate Sputtering Target Application
The Potassium Niobate Sputtering Target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.
Potassium Niobate Sputtering Target Bonding Services
Target Bonding Service is available for Potassium Niobate Sputtering Targets. Stanford Advanced Materials (SAM) is devoted to machining standard backing plates and working together with the Taiwan Bonding Company to provide bonding services.
Potassium Niobate Sputtering Target Packaging
Our Potassium Niobate Sputter Targets are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.
Specification
Material Type |
Potassium Niobate |
Symbol |
KNbO3 |
Color/Appearance |
Solid |
Melting Point |
≈ 1100 °C |
Density |
4.640 g/cm3 |
Type of Bond |
Elastomer, Indium |
Available Sizes |
Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ Thick: 0.125″, 0.250″ |
Other sizes are also available. Please contact us for customized sputtering targets.