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CU4544 Silver Copper Alloy Nanopowder (AgCu)

Catalog No. CU4544
Compositions Ag, Cu
APS 20nm, 50nm, 80-100nm, etc.
Purity 99.99%

Silver-Copper Alloy Nanopowder (AgCu) is a lead-free solder material commonly used for electrical interconnects and surface-mount technology (SMT) assembly. It offers excellent electrical conductivity, low resistivity, and superior dispersion properties. Additionally, the alloy demonstrates high stability, making it a reliable choice for advanced electronic applications.

Related products: Copper Alloy CuNi2SiCr Powder, Copper Alloy CuAlNiFe Powder, Silver Tin Alloy Nanopowder (AgSn)

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