Catalog No. | CU4544 |
---|---|
Compositions | Ag, Cu |
APS | 20nm, 50nm, 80-100nm, etc. |
Purity | 99.99% |
Silver Copper Alloy Nanopowder (AgCu) is a lead-free solder material for electrical interconnects and surface-mount technology assembly. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Silver Copper Alloy Nanopowder (AgCu).
Related products: Copper Alloy CuNi2SiCr Powder, Copper Alloy CuAlNiFe Powder, Silver Tin Alloy Nanopowder (AgSn)
Silver Copper Alloy Nanopowder (AgCu) is a lead-free solder material for electrical interconnects and surface-mount technology assembly. It has good conductivity, low resistivity, high disperse and high stability.
Chemical Composition |
Ag, Cu |
APS |
20nm, 50nm, 80-100nm, etc. |
Morphology |
Nearly spherical |
Purity |
99.99% |
Silver Copper Alloy Nanopowder (AgCu) is applied to the conductive adhesive, electromagnetic shielding conductive paint, conductive rubber, conductive plastic, polymer slurry, conductive electrostatic paint, etc.
GHS09
Warning
H410
P273 - P391 - P501
Aquatic Acute 1 - Aquatic Chronic 1
13 - Non Combustible Solids
WGK 3
Not applicable
Not applicable
dust mask type N95 (US), Eyeshields, Gloves
Our Silver Copper Alloy Nanopowder (AgCu) is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
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