CU4544 Silver Copper Alloy Nanopowder (AgCu)

Catalog No. CU4544
Compositions Ag, Cu
APS 20nm, 50nm, 80-100nm, etc.
Purity 99.99%

Silver Copper Alloy Nanopowder (AgCu) is a lead-free solder material for electrical interconnects and surface-mount technology assembly. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Silver Copper Alloy Nanopowder (AgCu).

Related products: Copper Alloy CuNi2SiCr Powder, Copper Alloy CuAlNiFe Powder, Silver Tin Alloy Nanopowder (AgSn)

Silver Copper Alloy Nanopowder (AgCu) Description

Silver Copper Alloy Nanopowder (AgCu) is a lead-free solder material for electrical interconnects and surface-mount technology assembly. It has good conductivity, low resistivity, high disperse and high stability.

Silver Copper Alloy Nanopowder (AgCu) Specifications

Chemical Composition

Ag, Cu

APS

20nm, 50nm, 80-100nm, etc.

Morphology

Nearly spherical

Purity

99.99%

 

Silver Copper Alloy Nanopowder (AgCu) Applications

Silver Copper Alloy Nanopowder (AgCu) is applied to the conductive adhesive, electromagnetic shielding conductive paint, conductive rubber, conductive plastic, polymer slurry, conductive electrostatic paint, etc.

Silver Copper Alloy Nanopowder (AgCu) SAFETY INFORMATION

Pictograms

GHS09

Signal Word

Warning

Hazard Statements

H410

Precautionary Statements

P273 - P391 - P501

Hazard Classifications

Aquatic Acute 1 - Aquatic Chronic 1

Storage Class Code

13 - Non Combustible Solids

WGK

WGK 3

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable

Personal Protective Equipment

dust mask type N95 (US), EyeshieldsGloves

Silver Copper Alloy Nanopowder (AgCu) Packaging

Our Silver Copper Alloy Nanopowder (AgCu) is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

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