sales@samaterials.com
(949) 407-8904
sales@samaterials.com
(949) 407-8904
| Catalog No. | CU4544 |
|---|---|
| Compositions | Ag, Cu |
| APS | 20nm, 50nm, 80-100nm, etc. |
| Purity | 99.99% |
Silver Copper Alloy Nanopowder (AgCu) is a lead-free solder material for electrical interconnects and surface-mount technology assembly. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Silver Copper Alloy Nanopowder (AgCu).
Related products: Copper Alloy CuNi2SiCr Powder, Copper Alloy CuAlNiFe Powder, Silver Tin Alloy Nanopowder (AgSn)
Silver Copper Alloy Nanopowder (AgCu) is a lead-free solder material for electrical interconnects and surface-mount technology assembly. It has good conductivity, low resistivity, high disperse and high stability.
|
Chemical Composition |
Ag, Cu |
|
APS |
20nm, 50nm, 80-100nm, etc. |
|
Morphology |
Nearly spherical |
|
Purity |
99.99% |
Silver Copper Alloy Nanopowder (AgCu) is applied to the conductive adhesive, electromagnetic shielding conductive paint, conductive rubber, conductive plastic, polymer slurry, conductive electrostatic paint, etc.
Our Silver Copper Alloy Nanopowder (AgCu) is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
FE4418 Pre-alloyed Powder FeCu18
FE4419 Pre-alloyed Powder FeCu30
FE4420 Pre-alloyed Powder FeCu40
FE4421 Pre-alloyed Powder Fe-Cu-Co-Ni
FE4415 Pre-alloyed Powder FeCu20
WM4457 Spherical Copper-coated Tungsten (W-Cu) Powder
CU4541 Copper Aluminum Alloy Powder (CuAl)
CU4542 Copper Zirconium Alloy Powder (CuZr)
CU4543 Copper Lanthanum Alloy Powder (CuLa)
Please fill in your details and one of our material experts will get back to you within 24 hours. For more information, contact us via E-mail at sales@samaterials.com.
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