Silver Copper Nickel Brazing Alloy AgCu28Ni0.75 Description
Silver Copper Nickel Brazing Alloy AgCu28Ni0.75 is a specialized vacuum solder composed of 72% silver (Ag), 28% copper (Cu), and 0.75% nickel (Ni). It is used primarily for vacuum soldering applications where high electrical and thermal conductivity, corrosion resistance, and reliable bonding strength are required. Adding nickel enhances the wettability on various substrates and improves the mechanical strength of the joints.
Silver Copper Nickel Brazing Alloy AgCu28Ni0.75 Specifications
Product Properties
Material
|
Ag, Cu, Ni
|
Density
|
10g/cm3
|
Form
|
Wire/Flake/Foil/Strip
|
Melting Temperature
|
779-815℃
|
Brazing Temperature
|
780-920℃
|
Resistivity
|
2.2 x 10-2
|
Chemical Composition %
Element
|
Ag
|
Cu
|
Ni
|
Content
|
71-73
|
27-29
|
0.5-1
|
Specification
Form
|
Diameter (mm)
|
Other
|
Welding Rods
|
φ1~6
|
-
|
Welding Wires
|
φ0.3~2.0
|
-
|
Welding Rings
|
0.4~2.44
|
I.D.: 3~30 mm
|
Welding Sheets
|
-
|
0.03~0.5 x 2~110 mm
|
Welding Powder
|
-
|
100-400 mesh
|
Silver Copper Nickel Brazing Alloy AgCu28Ni0.75 Applications
- Vacuum Electronics and RF Components
Ideal for sensitive components requiring flux-free soldering to avoid contamination.
Used in waveguides, microwave devices, and vacuum tubes.
Suitable for high-reliability applications where mechanical stability and conductivity are essential under extreme conditions.
Utilized in medical components for electrical interconnections and sensors where biocompatibility and reliability are needed.
- Power Modules and Heat Sinks
Used for thermal management by providing low-resistance bonding between metal parts and heat sinks.
- High-Purity Jewelry and Decorative Metal Bonding
Occasionally applied in high-end jewelry or artistic designs where strong, conductive bonding is required.
Silver Copper Nickel Brazing Alloy AgCu28Ni0.75 Packaging
Our Silver Copper Nickel Brazing Alloy AgCu28Ni0.75 is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
FAQs
Q1: What are the typical applications of AgCu28Ni0.75?
Aerospace components requiring reliable electrical connections
Vacuum electronics and microwave devices
Medical devices with biocompatibility needs
Power modules and heat sinks for thermal management
Sensors and optoelectronic equipment in extreme conditions
Q2: Why is nickel added to this solder alloy?
The addition of nickel (0.75%) improves:
- Wettability on difficult surfaces (e.g., nickel-plated metals)
- Oxidation resistance
- Mechanical strength and resistance to thermal cycling
Q3: What are the advantages of AgCu28Ni0.75 in vacuum environments?
Flux-free soldering ensures no contamination in sensitive components
Stable and reliable joints in harsh conditions
Minimal outgassing, which is essential in vacuum applications