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  • SN3987 SnBi17Cu0.5 Tin-based Alloy soldering paste

    • SN3987 SnBi17Cu0.5 Tin-based Alloy soldering paste

    Catalog No. SN3987
    Compositions Tin, Bismuth, Copper
    Appearance Dark grey paste

    SnBi17Cu0.5 Tin-based Alloy soldering paste has an appropriate melting point and can be used with original lead equipment reflux and small thermal impact on electronic components. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality SnBi17Cu0.5 Tin-based Alloy soldering paste.

    Related products: SnCu0.7 Tin-based Alloy Solder Powder, SnAg0.3Cu0.7 Tin-based Alloy Solder Powder, SnAg1.0Cu0.5 Tin-based Alloy Solder Powder, SnAg3.0Cu0.5 Tin-based Alloy Solder Powder

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    sc/1645682288-normal-snbi17cu0.5-tin-based-alloy-soldering-paste.jpg
    sc/1645682288-normal-snbi17cu0.5-tin-based-alloy-soldering-paste.jpg
    Description
    Specification

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