SN3986 SnBi58 Tin-based Alloy Solder Powder

Catalog No. SN3986
Compositions Tin
Appearance Deep grey or black powder

SnBi58 Tin-based Alloy Solder Powder is mainly used for component assembly on PCB (Printed Circuit Board). Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality SnBi58 Tin-based Alloy Solder Powder.

Related products: SnCu0.7 Tin-based Alloy Solder Powder,  SnAg0.3Cu0.7 Tin-based Alloy Solder Powder, SnAg1.0Cu0.5 Tin-based Alloy Solder Powder, SnBi17Cu0.5 Tin-based Alloy Solder Powder, SnBi30Cu0.5 Tin-based Alloy Solder Powder

SnBi58 Tin-based Alloy Solder Powder Description

SnBi58 Tin-based Alloy Solder Powder is mainly used for component assembly on PCB (Printed Circuit Board). SnBi58 Tin-based Alloy Solder Powder consists of 42% Tin and 58% Bismuth. Its melting point is 138℃.

SnBi58 Tin-based Alloy Solder Powder Specifications

Alloy Component

Melting

Point

Gravity g/cm3

Conduct heat

M.S.K

Extend

Mpa

Conductivity

%

Sn42Bi58

138

8.7

64

32

16.0

Particle Size

Type

3#

4#

5#

6#

7#

Size

25~45µm

20~38µm

15~25µm

10~18µm

5~15µm

SnBi58 Tin-based Alloy Solder Powder Applications

SnBi58 Tin-based Alloy Solder Powder is mainly used for component assembly on PCB (Printed Circuit Board).

SnBi58 Tin-based Alloy Solder Powder Packaging

Our SnBi58 Tin-based Alloy Solder Powder is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

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