Catalog No. | SN3986 |
---|---|
Compositions | Tin |
Appearance | Deep grey or black powder |
SnBi58 Tin-based Alloy Solder Powder is mainly used for component assembly on PCB (Printed Circuit Board). Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality SnBi58 Tin-based Alloy Solder Powder.
Related products: SnCu0.7 Tin-based Alloy Solder Powder, SnAg0.3Cu0.7 Tin-based Alloy Solder Powder, SnAg1.0Cu0.5 Tin-based Alloy Solder Powder, SnBi17Cu0.5 Tin-based Alloy Solder Powder, SnBi30Cu0.5 Tin-based Alloy Solder Powder
SnBi58 Tin-based Alloy Solder Powder is mainly used for component assembly on PCB (Printed Circuit Board). SnBi58 Tin-based Alloy Solder Powder consists of 42% Tin and 58% Bismuth. Its melting point is 138℃.
Alloy Component |
Melting Point℃ |
Gravity g/cm3 |
Conduct heat M.S.K |
Extend Mpa |
Conductivity % |
Sn42Bi58 |
138 |
8.7 |
64 |
32 |
16.0 |
Particle Size
Type |
3# |
4# |
5# |
6# |
7# |
Size |
25~45µm |
20~38µm |
15~25µm |
10~18µm |
5~15µm |
SnBi58 Tin-based Alloy Solder Powder is mainly used for component assembly on PCB (Printed Circuit Board).
Our SnBi58 Tin-based Alloy Solder Powder is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
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