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  • CU4273 Tin-Plated Copper Foil

    • CU4273 Tin-Plated Copper Foil

    Catalog No. CU4273
    Size Customized
    Thickness 12μm, or customized
    Working Temperature 20-120℃
    Purity Cu 99.9%

    Tin-Plated Copper Foil is suitable for Low frequency EMI Shielding. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Tin-Plated Copper Foil.

    Related products: Gold-plated Polyimide Film, Oxygen-free Copper Foil/Tape, Conductive Carbon Coated Copper Foil

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    Tin-Plated Copper Foil
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