CU4273 Tin-Plated Copper Foil

Catalog No. CU4273
Size Customized
Thickness 12μm, or customized
Working Temperature 20-120℃
Purity Cu 99.9%

Tin-Plated Copper Foil is suitable for Low frequency EMI Shielding. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Tin-Plated Copper Foil.

Related products: Gold-plated Polyimide Film, Oxygen-free Copper Foil/Tape, Conductive Carbon Coated Copper Foil

Tin-Plated Copper Foil Description

Tin-Plated Copper Foil is suitable for Low frequency EMI Shielding. The base material is rolled temper pure copper foil. The Foil not only has excellent electricity and thermal conductivity but also performs electro-chemical compacity and high corrosion resistance. It is used for the soldering process.

Tin-Plated Copper Foil Specification

Size

Customized

Thickness

12μm, or customized

Temperature

20-120℃

Cu Purity

99.9%

Tin-Plated Copper Foil Application

Tin-Plated Copper Foil is suitable for Low-frequency EMI Shielding.

Tin-Plated Copper Foil Packaging

Our Tin-Plated Copper Foil is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

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