sales@samaterials.com
(949) 407-8904
sales@samaterials.com
(949) 407-8904
| Catalog No. | CU4273 |
|---|---|
| Size | Customized |
| Thickness | 12μm, or customized |
| Working Temperature | 20-120℃ |
| Purity | Cu 99.9% |
Tin-Plated Copper Foil is suitable for Low frequency EMI Shielding. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Tin-Plated Copper Foil.
Related products: Gold-plated Polyimide Film, Oxygen-free Copper Foil/Tape, Conductive Carbon Coated Copper Foil
Tin-Plated Copper Foil is suitable for Low frequency EMI Shielding. The base material is rolled temper pure copper foil. The Foil not only has excellent electricity and thermal conductivity but also performs electro-chemical compacity and high corrosion resistance. It is used for the soldering process.
|
Size |
Customized |
|
Thickness |
12μm, or customized |
|
Temperature |
20-120℃ |
|
Cu Purity |
99.9% |
Tin-Plated Copper Foil is suitable for Low-frequency EMI Shielding.
Our Tin-Plated Copper Foil is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
CU4272 Gold-Plated Copper Foil
CU4274 Silver-Plated Copper Foil
CM4357 Spherical Brass Alloy (Cu40Zn) Powder
CM4359 Spherical Aluminum Bronze Powder
CU4541 Copper Aluminum Alloy Powder (CuAl)
CU4542 Copper Zirconium Alloy Powder (CuZr)
CU4543 Copper Lanthanum Alloy Powder (CuLa)
CU4544 Silver Copper Alloy Nanopowder (AgCu)
CU4563 Copper Boron Alloy Particles (CuB)
Please fill in your details and one of our material experts will get back to you within 24 hours. For more information, contact us via E-mail at sales@samaterials.com.
** Email address with your company's domain name is preferred. Otherwise, we may not be able to process your inquiry.
Inquiry List