Catalog No. | SN3985 |
---|---|
Compositions | Tin |
Appearance | Deep grey powder |
Ultrafine Tin-Based Alloy Solder Powder has excellent sphericity, narrow particle size distribution, and low oxygen content. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Ultrafine Tin-Based Alloy Solder Powder.
Related products: SnCu0.7 Tin-based Alloy Solder Powder, SnAg0.3Cu0.7 Tin-based Alloy Solder Powder, SnAg1.0Cu0.5 Tin-based Alloy Solder Powder, SnBi58 Tin-based Alloy Solder Powder
Ultrafine Tin-Based Alloy Solder Powder has excellent sphericity, narrow particle size distribution, and low oxygen content.
Specifications |
Particle Size(wt%) |
Oxygen Content (PPM) |
T5 |
T5+25um<10.0%; 25-15um>90.0%; -1um<10.0% |
<180 |
T6 |
T6 +15um<5.0%; 15-5um>90.0%; -5um<10.0% |
<400 |
T7 |
T7 +11um<5.0%; 11-2um>90%; 0-2um<10.0% |
<500 |
T8 |
T8 +8um<5.0%; 8-2um>85.0%; -2um<10.0% |
<800 |
T9 |
T9 +5μm <5.0%; 5-1um>85.0%; -lμm<10.0% |
<1000 |
Ultrafine Tin-Based Alloy Solder Powder is mainly used in precision assembly or packaging, Mini-LED and advanced application process, such as jet printing, roll printing, transfer printing, etc.
Our Ultrafine Tin-Based Alloy Solder Powder is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
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