SN3985 Ultrafine Tin-Based Alloy Solder Powder

Catalog No. SN3985
Compositions Tin
Appearance Deep grey powder

Ultrafine Tin-Based Alloy Solder Powder has excellent sphericity, narrow particle size distribution, and low oxygen content. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Ultrafine Tin-Based Alloy Solder Powder.

Related products: SnCu0.7 Tin-based Alloy Solder PowderSnAg0.3Cu0.7 Tin-based Alloy Solder Powder, SnAg1.0Cu0.5 Tin-based Alloy Solder Powder, SnBi58 Tin-based Alloy Solder Powder

Ultrafine Tin-Based Alloy Solder Powder Description

Ultrafine Tin-Based Alloy Solder Powder has excellent sphericity, narrow particle size distribution, and low oxygen content.

Ultrafine Tin-Based Alloy Solder Powder Specifications

Specifications

Particle Size(wt%)

Oxygen Content (PPM)

T5

T5+25um<10.0%; 25-15um>90.0%; -1um<10.0%

<180

T6

T6 +15um<5.0%; 15-5um>90.0%; -5um<10.0%

<400

T7

T7 +11um<5.0%; 11-2um>90%; 0-2um<10.0%

<500

T8

T8 +8um<5.0%; 8-2um>85.0%; -2um<10.0%

<800

T9

T9 +5μm <5.0%; 5-1um>85.0%; -lμm<10.0%

<1000

Ultrafine Tin-Based Alloy Solder Powder Applications

Ultrafine Tin-Based Alloy Solder Powder is mainly used in precision assembly or packaging, Mini-LED and advanced application process, such as jet printing, roll printing, transfer printing, etc.

Ultrafine Tin-Based Alloy Solder Powder Packaging

Our Ultrafine Tin-Based Alloy Solder Powder is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

 

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