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LE4092 Double Sided Adhesive Thermal Conductive Tape (No Substrate)

Catalog No. LE4092
Color White
Dimensions 1030mm*50m, or customizd
Thickness 0.15/0.2/0.25/0.3/0.4-0.5 mm
Density 1.8 g/cm3
Operating Temperature 0~80 ℃

Double Sided Adhesive Thermal Conductive Tape (No Substrate) is used for bonding heat sinks and other power dissipation semiconductors. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Double Sided Adhesive Thermal Conductive Tape (No substrate).

Related products: Silicon-Free Thermal Pad, Silicone Backed Thermal Pad, Strong Adhesive Thermal Silicone Sheet

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Double Sided Adhesive Thermal Conductive Tape (No substrate)
Double Sided Adhesive Thermal Conductive Tape (No substrate)
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