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Catalog No. | LE4092 |
Color | White |
Dimensions | 1030mm*50m, or customizd |
Thickness | 0.15/0.2/0.25/0.3/0.4-0.5 mm |
Density | 1.8 g/cm3 |
Operating Temperature | 0~80 ℃ |
Double Sided Adhesive Thermal Conductive Tape (No Substrate) is used for bonding heat sinks and other power dissipation semiconductors. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Double Sided Adhesive Thermal Conductive Tape (No substrate).
Related products: Silicon-Free Thermal Pad, Silicone Backed Thermal Pad, Strong Adhesive Thermal Silicone Sheet
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