Boron Carbide Nanopowder Description
Nano Boron Carbide (B4C) (CAS: 12069-32-8) is a black crystal with a metallic luster, and its hardness is second only to diamond and higher than silicon carbide. The Mohs hardness is 9.3. The chemical properties are stable and do not react with acid-based solutions. The relative density is 2.52, the melting point is 2350℃, and the boiling point is higher than 3500℃. Molten boron carbide can dissolve a large amount of graphitic carbon. Boron carbide is stable in dilute acid solution and can be decomposed by mixed acid of sulfuric acid and hydrofluoric acid, mixed acid of sulfuric acid and nitric acid.
Boron carbide has a high capture ability for thermal neutrons, wear resistance, and semiconductor conductivity. In most cases, boron carbide (B4C) is used as the control material, it can meet the requirements of high-temperature reactors. Increasing the concentration of B10 elements in boron carbide can improve the control efficiency of boron material.
Boron Carbide Nanopowder Specifications
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CAS Number
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12069-32-8
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Chemical Formula
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B4C
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APS
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60nm
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Form
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black powder
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Specific Surface Area(m2/g)
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39
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Bulk Density(g/cm3)
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1.7
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Tap Density(g/cm3)
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3.22
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Solubility
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Soluble in nitric acid and aqua regia. Insoluble in water.
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Boron Carbide Nanopowder Properties
Extreme Hardness: Nano Boron Carbide Powder is one of the hardest known materials, ranking just below diamond in terms of hardness. This property makes it exceptionally wear-resistant and suitable for applications requiring abrasion resistance and durability.
High Melting Point: With a melting point exceeding 2,200°C (3,992°F), Nano Boron Carbide Powder can withstand extreme temperatures, making it an ideal candidate for applications in harsh environments.
Chemical Inertness: This powder exhibits remarkable chemical stability, resisting corrosion and chemical reactions with most acids and alkalis. It remains unaltered in the presence of harsh chemicals, contributing to its longevity in various settings.
Excellent Thermal Conductivity: Nano Boron Carbide Powder boasts impressive thermal conductivity properties, making it valuable for applications involving heat dissipation and thermal management.
Boron Carbide Nanopowder Applications
Boron Carbide Nanopowder finds application across a wide range of industries and sectors:
Armor and Defense: Its exceptional hardness and lightweight nature make it a preferred material for body armor, vehicle armor, and protective shields.
Abrasives: Nano Boron Carbide Powder is used in abrasive materials for grinding, lapping, and polishing applications due to its outstanding wear resistance.
Nuclear Industry: It serves as a neutron absorber in nuclear reactors and radiation shielding due to its excellent neutron-capturing properties.
High-Temperature Applications: With its high melting point, it's utilized in the production of refractory materials, crucibles, and nozzles for applications involving extreme heat.
Electronics: Nano Boron Carbide Powder is used in semiconductor production, as a reinforcing agent in composites, and for thermal management in electronic devices.
Ballistic Protection: It is employed in the manufacture of bulletproof vests, ceramic armor plates, and armored vehicle components.
Boron Carbide Nanopowder Packaging
Our Nano Boron Carbide (B4C) is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
Boron Carbide Nanopowder FAQs
Q1: Can the powder be customized for specific applications?
A1: Yes, we offer customization options for particle size, morphology, and purity to meet specific application needs. Please contact our team to discuss your requirements.
Q2: How is Boron Carbide Nanopowder packaged for shipping?
A2: The powder is packaged in sealed, moisture-proof containers to prevent contamination and degradation. Packaging is designed to maintain the integrity of the product during transportation.
Q3: Is Nano Boron Carbide Powder suitable for additive manufacturing (3D printing)?
A3: Yes, Nano Boron Carbide Powder can be used as a component in 3D printing processes, particularly for producing high-strength, lightweight composites and ceramics.
