sales@samaterials.com
(949) 407-8904
sales@samaterials.com
(949) 407-8904
| Catalog No. | SN3981 |
|---|---|
| Compositions | Sn/Ag/Cu |
| Appearance | Gray powder |
| Particle Size | 5-45um |
SnAg1.0Cu0.5 Tin-based Alloy Solder Powder features lead-free and environmentally friendly, good welding strength, high-temperature reliability, excellent heat conductivity. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality SnAg1.0Cu0.5 Tin-based Alloy Solder Powder.
Related products: SnCu0.7 Tin-based Alloy Solder Powder, SnAg0.3Cu0.7 Tin-based Alloy Solder Powder, SnAg3.0Cu0.5 Tin-based Alloy Solder Powder, SnSb5 Tin-based Alloy Solder Powder
SnAg1.0Cu0.5 Tin-based Alloy Solder Powder features lead-free and environmentally friendly, good welding strength, high-temperature reliability, excellent heat conductivity.
|
Chemical Composition |
Sn/Ag/Cu |
|
Appearance |
Gray powder |
|
Particle Size |
5-15, 15-25, 20-38, 25-45um |
|
Melting Point ℃ |
217-225 |
SnAg1.0Cu0.5 Tin-based Alloy Solder Powder can be used in wave soldering, dipping and HASL applications.
Our SnAg1.0Cu0.5 Tin-based Alloy Solder Powder is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
SN3984 SnSb10 Tin-based Alloy Solder Powder
SN3985 Ultrafine Tin-Based Alloy Solder Powder
SN3986 SnBi58 Tin-based Alloy Solder Powder
SN3987 SnBi17Cu0.5 Tin-based Alloy soldering paste
SN3988 SnBi30Cu0.5 Tin-based Alloy soldering paste
SN4261 Tin Lead Bar
SN4262 Tin Lead Solder Wire
SN4263 Tin Zinc Ingot
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