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SN3981 SnAg1.0Cu0.5 Tin-based Alloy Solder Powder

Catalog No. SN3981
Compositions Sn/Ag/Cu
Appearance Gray powder
Particle Size 5-45um

SnAg1.0Cu0.5 Tin-based Alloy Solder Powder features lead-free and environmentally friendly, good welding strength, high-temperature reliability, excellent heat conductivity. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality SnAg1.0Cu0.5 Tin-based Alloy Solder Powder.

Related products: SnCu0.7 Tin-based Alloy Solder Powder, SnAg0.3Cu0.7 Tin-based Alloy Solder Powder, SnAg3.0Cu0.5 Tin-based Alloy Solder Powder, SnSb5 Tin-based Alloy Solder Powder

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