SN3982 SnAg3.0Cu0.5 Tin-based Alloy Solder Powder

Catalog No. SN3982
Compositions Sn/Ag/Cu
Appearance Grey powder
Compositions Sn/Ag/Cu
Appearance Grey powder

SnAg3.0Cu0.5 Tin-based Alloy Solder Powder has better wetting and spread ability. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality SnAg3.0Cu0.5 Tin-based Alloy Solder Powder.

Related products: SnCu0.7 Tin-based Alloy Solder Powder, SnAg0.3Cu0.7 Tin-based Alloy Solder Powder, SnAg1.0Cu0.5 Tin-based Alloy Solder Powder, SnSb5 Tin-based Alloy Solder Powder

SnAg3.0Cu0.5 Tin-based Alloy Solder Powder Description

SnAg3.0Cu0.5 Tin-based Alloy Solder Powder was developed to have better fluidity and low drossing in the dipping and wave soldering process. It has better wetting and spreadability. The welding powder is ball-shaped. It features good sphericity, homogenous alloy composition, and a smooth surface of the product. Oxygen content is strictly controlled during the production and packing of all alloy welding powder. An oxygen determinator is adopted to determine the surface oxygen content and a chemical assay is adopted to determine the total oxygen content. Advanced powder classification and collection technology enable the alloy welding powder free of powder smaller than 20um.

SnAg3.0Cu0.5 Tin-based Alloy Solder Powder Specifications

Melting Point

217-220℃

Tensile Strength

48.548 Mpa

Yield Strength

40.808 Mpa

Toughness

23.126Mpa

Density

7.36g/cm3

Cycle Fatigue Resistance

3600Nf

SnAg3.0Cu0.5 Tin-based Alloy Solder Powder Applications

SnAg3.0Cu0.5 Tin-based Alloy Solder Powder is developed to have better fluidity and low drossing in the dipping and wave soldering process.

SnAg3.0Cu0.5 Tin-based Alloy Solder Powder Packaging

Our SnAg3.0Cu0.5 Tin-based Alloy Solder Powder is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

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