AU2029 Gold Bonding Wire

Catalog No. AU2029
Material Pure gold (Au)
Purity 2N-4N
Diameter 13-70μm
Length 100-500m

We can control the diameter of gold bonding wires depending on the customers’ requests. Stanford Advanced Materials (SAM) is a leading supplier of metallic bonding wires.

Other related products: Copper Bonding Wire, Aluminum Bonding Wire, Silver Bonding Wire, Silver Alloy Bonding Wire.

Gold Bonding Wire Description

The gold bonding wire is a kind of material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. SAM can provide Au bonding wire with different wire diameters from 13um-50um according to customer requirements.

gold bonding wire

Gold Bonding Wire Specifications

Mechanical properties

Dia

 EL%

Properties

BL(CN)

um

mil

AUBW02

AUBW03/AUBW06

AUBWD05/AUBWD07

AUBWD01/AUBWD03/AUBWD99/

AUBWD06/AUBW10

13

0.5

2-5

/

>2.5

>2.5

>3.0

14

0.55

2-5

/

>3.0

>3.0

>3.0

15

0.6

2-5

/

>3.0

>3.5

>4.0

16

0.63

2-5

>2.5

>3.0

>3.5

>4.0

17

0.67

2-5

>2.5

>3.0

>3.5

>4.0

18

0.7

2-5

>2.5

>3.5

>4.0

>5.0

19

0.75

2-6

>3.0

>4.0

>4.5

>5.5

20

0.8

2-6

>4.0

>4.5

>6.0

>6.0

21

0.83

2-6

>4.5

>5.0

>6.0

>6.5

22

0.87

2-7

>4.5

>5.5

>6.0

>7.0

23

0.9

2-7

>5.0

>6.0

>7.0

>8.0

24

0.94

2-7

>6.0

>6.5

>7.5

>9.0

25

1

2-8

>7.0

>8.0

>10.0

>10.0

28

1.1

2-8

>9.0

>10.0

>12.0

>11.0

30

1.2

3-8

>11.0

>12.0

>13.0

>15.0

32

1.25

3-8

>12.0

>13.0

>15.0

>16.0

33

1.3

3-8

>13.0

>14.0

>16.0

>18.0

35

1.4

3-10

>15.0

>16.0

>18.0

>22.0

38

1.5

3-10

>17.0

>18.0

>21.0

>22.0

40

1.57

3-10

>20.0

>22.0

>24.0

>26.0

45

1.8

3-12

>24.0

>25.0

>28.0

>30.0

50

2

3-12

>30.0

>32.0

>34.0

>36.0

60

2.4

7-14

>43.0

>45.0

>50.0

>52.0

70

2.8

7-14

>50.0

>55.0

>60.0

>63.0


Gold Bonding Wire 
Applications

- Smartphone and phone
- Wearable electronics
- IVD
- Imaging
- CV therapy
- Orthopedics and spine
- Commercial aircraft
- satellite
- NFC technology
- Power generation

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