Description of Silver Alloy Bonding Wire
The bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. SAM can provide Ag bonding wire with different wire diameters from 15um-30um according to customer requirements.
Features of silver alloy bonding wire
- Better physical properties than Au bonding wire
- Easier to store than copper
- No gas protection request, reducing production costs
- Lower purchase cost than that of Au wire
- Does not oxidize in clean air
Specifications of Silver Alloy Bonding Wire
Diameter
|
Properties
|
EL%
|
BL(CN)
|
um
|
mil
|
AABW-1
|
AABW-2
|
AABW-3
|
AABW-1
|
AABW-2
|
AABW-3
|
15
|
0.6
|
2-8
|
2-8
|
2-8
|
>2.5
|
>2.5
|
>3
|
16
|
0.63
|
2-8
|
2-8
|
2-8
|
>2.5
|
>2.5
|
>3
|
17
|
0.67
|
2-8
|
2-8
|
2-8
|
>2.5
|
>3
|
>4
|
18
|
0.7
|
2-8
|
2-8
|
2-8
|
>2.5
|
>3
|
>4
|
19
|
0.75
|
2-8
|
2-8
|
2-8
|
>2.5
|
>3
|
>5
|
20
|
0.8
|
2-10
|
2-8
|
2-8
|
>4
|
>4
|
>6
|
23
|
0.9
|
2-12
|
2-8
|
2-8
|
>5
|
>6
|
>8
|
25
|
1.0
|
2-12
|
2-8
|
2-8
|
>7
|
>8
|
>10
|
27
|
1.06
|
2-12
|
2-8
|
2-8
|
>8
|
>9
|
>12
|
28
|
1.1
|
2-12
|
2-8
|
2-8
|
>8
|
>9
|
>12
|
30
|
1.2
|
2-14
|
2-10
|
2-10
|
>11
|
>12
|
>14
|
33
|
1.3
|
2-14
|
2-10
|
2-10
|
>12
|
>13
|
>15
|
35
|
1.4
|
2-14
|
2-10
|
2-10
|
>12
|
>13
|
>15
|
37
|
1.45
|
2-14
|
2-10
|
2-10
|
>15
|
>16
|
>17
|
38
|
1.5
|
2-16
|
2-12
|
2-10
|
>17
|
>18
|
>20
|
40
|
1.6
|
2-16
|
2-12
|
2-10
|
>18
|
>20
|
>20
|
42
|
1.65
|
2-16
|
2-12
|
2-10
|
>18
|
>20
|
>25
|
45
|
1.8
|
2-16
|
2-12
|
2-10
|
>18
|
>20
|
>25
|
50
|
2.0
|
3-18
|
3-10
|
3-10
|
>20
|
>25
|
>30
|
Applications of Silver Alloy Bonding Wire
- Semiconductor discrete components
- Light-emitting diodes (LEDs)
- Integrated circuits