CM3434 Copper Strip/Foil C1100

Catalog No. CM3434
Standard JIS H3250-2006
Content 99.95%
Grade C1100
Shape Tape, Foil
Size Customized

Copper Strip C1100 has no hydrogen embrittlement, high conductivity, good processing performance, welding performance, corrosion resistance, and low-temperature performance. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Copper Strip C1100.

Related products: Beryllium Copper Plate/SheetCopper Foil (Cu Foil), Oxygen-free Copper Tape/Foil

Copper Strip C1100 Description

Copper Strip C1100 has good electrical conductivity, thermal conductivity, corrosion resistance, and processing properties, and can be welded and brazed. Containing fewer impurities that reduce electrical conductivity and thermal conductivity, a trace of oxygen has little effect on electrical conductivity, thermal conductivity, and processing performance, but it is easy to cause "hydrogen disease". It is not suitable for processing (annealing, annealing, Welding, etc.) and use.

Copper Strip C1100 Specifications

Chemical Composition (%)

Cu+Ag

Sn

Zn

Pb

Ni

Fe

Sb

S

As

Bi

O

99.90

0.002

0.005

0.005

0.005

0.005

0.002

0.005

0.002

0.001

0.06

Tensile strength: 245345

Elongation: ≥8

Hardness: 75120HV

Copper Strip C1100 Applications

Used in Printed Circuits.

Copper Strip C1100 Packaging

Our Copper Strip C1100 is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

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