Silicon Wafer Supplier | Stanford Advanced Materials

Catalog No.	CY2174
Material	Si
Thickness	275 um ~ 775 um
Conductive Type	N - type / Semi-insulating
Diameter	Ø 2" / Ø 3" / Ø 4" / Ø 6" / Ø 8" / Ø 12"
Electrical Resistance (µOhm-cm)	0.01 ~ 10000 ohm-cm
Growth	CZ / FZ

SAM produces any diameters from 2’’ (50.8 mm) to 12’’ (304.8mm) in order to provide the most flexibility as possible. With the aim of providing the largest range of specifications, we work either Cz (Czochralski) or FZ (Float Zone) silicon wafers.

Description of Silicon Wafer

Silicon wafer is a material used for producing semiconductors, which can be found in all types of electronic devices that improve the lives of people. It is the most common material and widely used for a variety of high-tech industries. Due to the uniqueness of the electrical currents via silicon wafers, these semiconductors are used in creating ICs (integrated circuits) to act as commands for specific actions in various electronic devices.

Specifications of Silicon Wafer

Growth	CZ / FZ
Diameter	Ø 2" / Ø 3" / Ø 4" / Ø 6" / Ø 8" / Ø 12"
Thickness	275 um ~ 775 um
Orientation	<100> / <111> / <110> or others
SIIConductivity	P - type / N - type / intrinsic
Dopant	Boron / Phosphorous / Antimony / Arsenic
Resistivity	0.001 ~ 10000 ohm-cm
Surface	One side polished / two sides polished
TTV	<= 10 um
Bow / Warp	<= 40 um
Grade	Prime / Test / Dummy grade

Available Silicon Wafer

CZ or FZ Wafer	Prime Wafer
Intrinsic Wafer	Test Wafer
Heavily Doped Wafer	High Resistivity Wafer
Off Axis Orientation Wafer	Special Orientation Wafer
Ultra Flat Wafer	Ultra-Thin Wafer
Ultra Thick Wafer	Double Sides Polished
Thermal Oxide Wafer	Epi Wafer

Applications of Silicon Wafer

- Discrete
- Power device
- PW transistor IGBT
- MOS IC
- MEMS
- Solar cells

CY2174 Silicon Wafer

Description of Silicon Wafer

Specifications of Silicon Wafer

Available Silicon Wafer

Applications of Silicon Wafer

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