SV3684 Low Voltage Contact (FAg)

Catalog No. SV3684
Material FAg
Density 10.47 (g/cm3)
Resistivity 1.80 (μΩ·cm)
Hardness 80~100(HV 0.3)
Tensile Strength 320~400(MPa)
Elongation after Breaking % 2

Low Voltage Contact (FAg) is achieved by adding a trace of nickel to pure silver to inhibit the growth of silver crystal grains and obtain a fine-grained structure. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Low Voltage Contact (FAg).

Related products: Low Voltage Contact (AgNiC)Low Voltage Contact (FAg)Low Voltage Contact (AgSnO2/AgSnO2In2O3)High Voltage Contact (CuW/CuCr0.7)

Low Voltage Contact (FAg) Description

Fine-grained silver is achieved by adding a trace of nickel to pure silver to inhibit the growth of silver crystal grains and obtain a fine-grained structure, thereby improving the strength and hardness of the material and the resistance to welding and arc erosion. It maintains good electrical conductivity and the advantage of low contact resistance.

Low Voltage Contact (FAg) Specifications

Material

FAg

Density (g/cm3)

10.47

Resistivity (μΩ·cm)

1.80

Hardness (HV 0.3)

80~100

Tensile Strength (MPa)

320~400

Elongation after Breaking %

2

Low Voltage Contact (FAg) Applications

Micro switches for radio and communication, small-capacity low-voltage electrical appliances.

Low Voltage Contact (FAg) Packaging

Our Low Voltage Contact (FAg) is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

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