VD0638 Nickel Copper (Ni/Cu) Evaporation Materials

Description

Nickel Copper (Ni/Cu) Evaporation Materials are essential components in physical vapor deposition processes, boasting a blend of nickel and copper elements that endow them with versatile properties. These materials exhibit excellent thermal stability, electrical conductivity, and corrosion resistance, making them ideal for thin film coatings in various applications. With their compatibility with semiconductor fabrication processes, Nickel Copper (Ni/Cu) Evaporation Materials find extensive use in the electronics industry, particularly in the production of integrated circuits, microelectronic devices, and sensors. Their tailored composition and consistent deposition characteristics ensure reliable performance and adherence to stringent quality standards in thin film deposition applications.

Specification

Applications

1. Semiconductor industry: For the manufacture of metallization layers, connecting wires, and conductive layers for integrated circuits (ICs), microelectronic devices, and other semiconductor components.

2. Optical coatings: Anti-reflective coatings and reflective coatings for the manufacture of optical lenses, lenses, mirrors, and other optical components.

3. Electronics: For the manufacture of electronic components such as resistors, inductors, connectors, and wires.

4. Thermal Management: Used in aerospace, automotive, and electronic equipment to manufacture heat sinks, heat transfer plates, and thermal control coatings.

5. Anti-corrosive coatings: Used in chemical equipment, ships, and marine engineering to provide corrosion resistance

6. Metal Alloy Preparation: Used as one of the components of other metal alloys to improve their mechanical properties and corrosion resistance.

Packing

Our Nickel Copper (Ni/Cu) Evaporation Materials are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage caused during storage or transportation.